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Wafer cassette

Manufacturing process

Machining process
MaterialAL,SS  or ESD plastic.

Application

How to order

Data input

Surface treatment

Option

Use for handling wafer in the process of
Wafer slice

Wafer mount
Back grinding

Wafer diameter

For AL material,

Colorful  anodized  and Nickel plating

 

Custom marking

Custom machining

Custom design

Recessed Barcode pad

 
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