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Wafer frame,



Manufacturing process

Laser cutting or stamping
Material:Stainless Steel or Aluminum


Application

How to order

Data input

Surface treatment

Option

wafer mount
Back grinding
Wafer sawing
Die attach
Shipping


The machine model;
Package description;
Wafer size.

1.Fine polishing
2.matting finish
3.Nickel plating
1.1.0,1.2,1.5
2. Laser
3. marking barcode

 

 
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